underfill การใช้

• An additional advantage of underfill is that it limits tin whisker growth.
• The underfill theory involves activation of the renin angiotensin aldosterone system, which leads to an increase in absorption of sodium from the kidney tubule ( termed " renal sodium avidity " ) mediated by aldosterone, which acts on mineralocorticoid receptors in the distal convoluted tubule.
• Mechanical stress issues can be overcome by bonding the devices to the board through a process called " underfilling ", which injects an epoxy mixture under the device after it is soldered to the PCB, effectively gluing the BGA device to the PCB . There are several types of underfill materials in use with differing properties relative to workability and thermal transfer.